Hi,

coating of three-dimensional microstructures seems to be difficult when
using conventional spin coating techniques.
A new technology of electro-spray coating solves this handicap and thus
offers new opportunities in manufacturing sophisticated microstructure, as
used in microsystem technology. Microchannels, deep etched cavities or
pyramid-like through-holes can be easily created in silicon wafers by
anisotropic etching prozesses.  The walls or the bottoms have to be equipped
with structured metal lines or electrodes . With the electro-spray technique
the perforated wafer can be easily coated with the resist layer and the
patterning can be performed photolithographically. For more information
please feel free to send an e-mail.

With best regards
Andreas



Andreas Scheipers
D-48308 Senden
Germany
andreas.scheipers@t-online.de
Tel.: +49 (0) 2597 96 762



----- Original Message -----
From: "mems work" 
To: 
Sent: Monday, August 04, 2003 12:26 AM
Subject: [mems-talk] Electrodes in Microchannel


> Hi..
>      Can anyone point to me to papers on making electrodes in a
> microchannel for a microfluidic application with electrophoresis and
> electroosmosis or MHD requirements...
>
> Also any pointers to photoresist patterning of the bottom and sidewalls of
a
> silicon microchannel ?
>
>
> Thanks,
> Anand
>
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