Hi Andreas,

I am also thinking about using Eagle Resist form my high topography
substrates.
But what do you mean with your electro-spray coating technique? What's
the different to standard spray-coating?

Hope to hear from you soon!

Best regards,
Jochen Zöllin

IMTEK, Materialien
Albert-Ludwigs-Universität
Georges-Koehler-Allee 103
D-79110 Freiburg, Germany
Tel. +49 761 203 7207
Fax: +49 761 203 7192
E-mail: zoellin@imtek.uni-freiburg.de


-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces+zoellin=imtek.de@memsnet.org
[mailto:mems-talk-bounces+zoellin=imtek.de@memsnet.org] Im Auftrag von
Andreas Scheipers
Gesendet: Montag, 18. August 2003 17:00
An: General MEMS discussion
Betreff: Re: [mems-talk] Electrodes in Microchannel

Hi Tom,

The standard spin coating technology produces highly uniform layer on a
planar surface.
However, in the case where wafer through-holes, pyramids, walls, grooves
or
"high-aspect structures" are present, the coating is rich in striations
and
holes are filled with photoresist. On such coating, lithography could
not be
successfully performed. I would tend to recommend a technique with
electrodepositable photoresist (Shipley ED Eagle 2100 or Pepr 2400) or
our
electro-spray coating technique, which allows uniform photoresist
coverage
(resist thickness varies with the deposition time and is typically
adjusted
between 1µm and 2µm, which is similar to conventional spin-on coating)
on
highly textured surfaces and makes subsequent lithography steps
possible.

For more information
please feel free to contact me.

With best regards
Andreas



Andreas Scheipers
D-48308 Senden
Germany
andreas.scheipers@t-online.de
Tel.: +49 (0) 2597 96 762
Fax: +49 (0) 2597 96 769



----- Original Message -----
From: "Tom Fan" 
To: 
Sent: Wednesday, August 13, 2003 2:15 AM
Subject: [mems-talk] Electrodes in Microchannel


>
>
>
> On the same topic, would 4-um high structures (serving as electrodes)
standing
> on otherwise flat substrates be considered "high-aspect-ratio"
structures?
> Would conventional resist spin coating process do the job? And also
can
the
> lithographic tool handle a height difference of 4 um (if exposures on
and
off
> the structures are desired)?
>
>
> Thanks,
> Tom
>
>


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