Benny,
What is the percent of P electroless Ni you use?
You can check solutions of electroless Ni with different percent of phosphor
(mid, low and high).
Enthone has all the kinds. Theoretically, the layer with the higher P
content should be better diffusion barrier.

David

-----Original Message-----
From: mems-talk-bounces+davido=shellcase.com@memsnet.org
[mailto:mems-talk-bounces+davido=shellcase.com@memsnet.org]On Behalf Of
FungWaHong@mrst.com.cn
Sent: Saturday, September 06, 2003 4:33 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Ni diffusion on Au under 800C


I'm now working for a MEMS devices which work under 600 C. 2 microns
electroless Ni and 2 microns Au are plated on Cu substrate. Some white
spots is observed after 600 C thermal testing. I guess that would be due to
metal diffusion. Would profession suggest a better diffusion barrier rather
than Ni?

Benny Hong



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