Hi all,

I am interested in MEMS wafer bonding using dry etch BCB or photo-BCB from DOW
Chemicals. Does anyone can tell me which BCB, dry etch BCB or photo-BCB, is more
easier to perform adhesive wafer bonding successfully?

I want to bond a MEMS device and a silicon cap (with cavities etched in it)
together.

Best regards,

Richard Jiang


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Richard Jiang

Shanghai Institute of Microsystem and Information Technology, CAS
865 Changning Road
Shanghai 200050, China
yqjiang55@yahoo.com
Tel: 86-21-62511070-5966

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