Hey,

I have worked with EDP and KOH before and I think it should be possible to
make the structure that u have described with the process that u have
described.

The wall o the groove needs to be parallel to the (110) flat. Lateral
etching maybe a problem. U have not mentioned the etch depth.

The paper "Methods for the fabrication of convex corners in anisotropic
etching of (100) silicon in aqueous KOH, Sensors and Actuators A: Physical,
Volume 25, Issues 1-3, October 1990, Pages 9-13 " may be o help.

Hope that helps

Ashwin Seshadri
Graduate Student
Material Science Dept.
Univ. of Texas at Arlington





>From: "Choe,S-H" 
>Reply-To: General MEMS discussion 
>To: "General MEMS discussion" 
>Subject: [mems-talk] Etching Method
>Date: Wed, 8 Oct 2003 22:41:00 +0900
>
>Dear all;
>
>I want to make a mold as followed.
>(please open following homepage address. There will be a picture.)
>
>http://my.dreamwiz.com/kotai75/picture/Etching.JPG
>
>The substrate is (100) Silicon wafer and Oxide will be used as a mask.
>
>1. Oxide deposition.
>2. Wet Etching (TMAH)  for pyramid tip (111)
>3. Deep RIE Etching.
>
>So, I want to know these following process can make a mold like that?
>or Should I take another process ?
>
>I always thanks all of you for kind answer.
>
>Choe,SeongHun
>choe@mems.mech.tohoku.ac.jp
>
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