durusmail: mems-talk: Solgel process / low temperature bonding
Solgel process / low temperature bonding
2003-10-23
2003-10-31
2003-11-03
Solgel process / low temperature bonding
Mark M Crain
2003-11-03
HI Brad,

Could you go into more detail about your bonding process and the bonding
material?

Thanks,

Mark Crain
University of Louisville
502/852-1572

>>> bjohnson@suss.com 10/31/03 1:26 PM >>>
Hello Bob,
How low a temp are you looking at?  We have achieved very good results
bonding Pyrex to Pyrex and Pyrex to Silicon at room temp then annealing
at much less then 300C.  If you are looking for a permeant bond this
would work great.

Brad

Brad Johnson
Suss MicroTec
Applications Engineer
1-480-557-9370 Ext119
1-800-685-7877 Ext119
bjohnson@suss.com


>>> bob_mems@yahoo.com 10/23/03 06:44PM >>>
Hello All,

Is sol-gel process a good method to bond glass?  If anybody has
experience with that type of procedure, can you please share it with me?

Are there any other way of bonding glass using low temperature?

Any information will be appreciated.

Thanks,

Robert


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Date: Thu, 23 Oct 2003 19:59:53 -0400
From: Alik Widge 
Subject: Re: [mems-talk] Photosensitive SAM
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Yi-Ping,

Most self-assembled monolayers are sensitive to UV-induced desorption if

the dose is high and long enough, especially the thiol-based SAMs. Look
through George Whitesides' paper archive at Harvard and you'll find 99%
of
what you need.

Alik


--On Thursday, October 23, 2003 8:44 AM +0800 Yi-Ping Ho 
wrote:

> Hi there,
>
> Is there any one who knows how to make the photosensitive SAM(Self
> Assemble Monolayer)? Or any reference papers?
>




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