Dear Hu,
It is not possible to reach less than 390°C.
If it was possible, everybody could use it!
Bye


Huxiaodong a écrit :

> Dear MEMS Community,
> Does anyone know about any glass-frit bonding process for WLP package of MEMS
devices that has a process temperature below 300 Celcuis degree?
> Any information will be greatly appreciated.
> Yours Sincerely,
> Hu Xiaodong.
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Dr. Paolo Bondavalli
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