Vidya, An interfacial approach to the low incorporation of silica - the hydrophilic nature of the surface of silicon dioxide. The surface of oxide particles have OH- groups and other adsorbed ions. The adsorbed ions on the surface form a charged double layer and impart a net surface potential to it (zeta potential, ? ). Silica becomes positively charged due to the adsorption of H+ or Cu2+ or the dissociation of OH- groups. When the amount of adsorbed positive excess surface charge is equal to that of the OH- groups, the observed solution pH corresponds to the point of zero charge (pzc) of the system. In pH ranges below the pzc, excess cations are adsorbed on the surface, while in pH ranges above the pzc, the oxide surface has excess OH- ions or releases cations. A large surface concentration of OH- ions will affect the copper reduction especially if the Cu-ligand (as used in electroless deposition) is negatively charged. How to improve the codeposition - one way recently tried involved the modification of surface properties of silica particles by titania and alumina, by hydrolysis (D. Aslanidis et al, J. Electrochem. Soc. 139, 1992). I am unsure if this will help in your case. Tl+, Ce+, Rb+, NH4+, Tetra ethylene pentamine (TEPA), and (Ethylene diamine Tetracetic acid)EDTA are also known to promote codeposition of hydrophillic particulates. Here are a few references which might help: Fransaer/Celis (New Insights into the mechanism of composite plating, Galvanotechnik, 92, 2001) A. Hovestad et al, J. of Appl. Electrochem, 25, 1995. Modern Electroplating, by M. Schlesinger, M. Paunovic Amrit. -----Original Message----- From: vidya_iitk [mailto:vidya_iitk@indiatimes.com] Sent: Friday, December 05, 2003 3:09 AM To: mems-talk@memsnet.org Subject: [mems-talk] Electroless Cu-plating on SiO2 powder Dear Sirs, I am doing experiment to study the behaviour of electroless Cu plated sintered Sic and SiO2 powders. I am able to do electroless plating of Cu on SiC but finding difficulty to electroless plating on SiO2 powder. Could you please help me in this regard. Thanking You. Galphade V.S. Lecturer in Metallurgy Govt. College of Engg. Pune, INDIA 411005 _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/