The adhesion of Pt on the materials you mention is normally quite poor. An
adhesion-layer is normally used (e.g. CT, Ti, Pt).
We have sputtered Pt directly onto low-stress nitride in the past and the
adhesion there was fine (tested with scotch-test). Some people also make
Pt-silicide by depositing Pt directly on Si and then doing an anneal-step,
but I don't know if they take additional precautions to get proper adhesion
of the Pt on the Si.
Succes.

Jason

___________________________________________________________
Jason Viotty
Senior Process Engineer
C2V
http://www.c2v.nl


-----Original Message-----
From: Raj Kumar [mailto:raj@sclchd.co.in]
Sent: zaterdag 20 december 2003 5:51
To: mems-talk@memsnet.org
Subject: [mems-talk] Adhesion of Pt on Si, SiO2 and Si3N4



Hello Memsnetigens

     Can anybody tell me adhesion behaviour of sputtered and e-beam
evaporated Platinum layer on Si, Si3N4 and SiO2.

 RAJKUMAR
 SCL,INDIA
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