The hole is very small(5um), and ebeam resist viscasity is low and are
commonly spinned on at high rotation speed. so the resist is very thin and
it can suspend itself on top of the hole and not fall in. if your intend to
fill the hole, you can try to use double layer resist, the first layer
function as planarization( AZ5214 spinned at 1500rpm should do). of course,
then you need transfor your image to the bottom layer by using very
anisotropic oxigen plasma. there is a lot of double layer scheme that can
also be developed togather with top layer resist...
----- Original Message -----
From: "laurent gangloff" 
To: 
Sent: Monday, January 05, 2004 5:00 AM
Subject: [mems-talk] resist does not penetrate holes


> Hi all,
> I've encountered some problem with resist deposition. UVIII (the
> e-beam/deep-UV resist I use from Shipley) covers the holes I want to
> coat (5µm diameter, 1µm depth) but does not penetrate it.
> Does anybody know where this problem comes from?
> Thanks for your suggestions.
>
>
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>