I've used Baker ALEG-355 (heated to 70C) as a solvent for removing stubborn PR. It typically doesn't attack metals. Perhaps that will work. Jesse Fowler UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV Los Angeles, CA 90095-1597 | (310)825-3977 "Facts are stubborn, but statistics are more pliable." -- Mark Twain On Mon, 5 Jan 2004, sokwon Paik wrote: > > I tried to remove s1818 layer after I deposited my > designed layer. I used MF319 as I did always but it > didn't removed s1818 layer clearly. I tried to use > acetone to remove this s1818 layer but it failed. > some remained s1818 layer covered my design layer. > I tried to use shipley 1165 remover but it failed. > I'm thinking of using RIE. But I'm afraid it could > hurt the seed layer also. > > Anybody have any idea of removing this layer? > > If you let me know it then it would be very great. > > Thanks, > > Sokwon Paik > Ph.D student > Texas A&M University > > __________________________________ > Do you Yahoo!? > Yahoo! Hotjobs: Enter the "Signing Bonus" Sweepstakes > http://hotjobs.sweepstakes.yahoo.com/signingbonus > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ > >