Dear All,

I am working on electrolessly deposited copper films on polymer substrates.
After the deposition, I have to protect the copper structures from oxidation. I
know of annealing process but it requires high temperatures which the polymer
substrate might not withstand. Is there any chemical process by which the copper
lines/structures can be protected, without  a change in copper characteristics.
Please suggest.

Sincerely,
Sreelakshmi Yenamandra




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