Dear All,
                     I have a sample of Si coated with first Nickel(20nm) then
Gold(50nm) and then Aluminium(40nm).Then I did patterning with negative
photoresist (type-SC 100).The patterning is of micron size rings.
I have to expose silicon in that rings.

For this I etched succesfully Aluminium with
 Phosphoric acid : DI Water :: 1: 50, at temp. 25-27C with etching time
15min.and it did not effect the photoresist.And then for gold I first used
Aquaregia which did not etch the gold in my sample(micron size rings) and also
badly effected the photoresist.Then for this gold I used
KI : I2 : DI Water :: 5 : 1: 50, at temp. 25-27C, time-1min. but it also
effected the photoresist.I am not able to understand,how to handle this
situation.Also what should I use to etch Nickel and in what proportions and
time.
Can anybody help me.

Hare Krishna


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