Hi,
    Could you pls specify the pO2 ( partial pr) that you are using for the Cu
heat treatment.Pls let me know,
           Thanks
                Dipankar
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--------- Original Message ---------

DATE: Fri, 23 Jan 2004 09:10:54
From: "Bill Moffat" 
To: "General MEMS discussion" 
Cc:

>Need to know more about your polymer substrate.  A common process used by a
number of my customers is to deposit copper on Polymide then anneal at 300
degrees C and reduce the copper oxide by virtue of the extremely low parts per
billion Oxygen and the temperature.  Polymide will withstand high temperatures.
We have a specialized Polymide bake oven with extremely low Oxygen concentration
that our Silicon wafer customers take up to 450 degrees C.  If your Polymer can
withstand this temperature let me know if you want to test anneal some
structures.  Bill Moffat
>
>-----Original Message-----
>From: Sreelakshmi Yenamandra [mailto:ethelda496@yahoo.com]
>Sent: Thursday, January 22, 2004 1:04 PM
>To: MEMS-talk@memsnet.org
>Subject: [mems-talk] electrolessly deposited copper protection
>
>
>Dear All,
>
>I am working on electrolessly deposited copper films on polymer substrates.
After the deposition, I have to protect the copper structures from oxidation. I
know of annealing process but it requires high temperatures which the polymer
substrate might not withstand. Is there any chemical process by which the copper
lines/structures can be protected, without  a change in copper characteristics.
Please suggest.
>
>Sincerely,
>Sreelakshmi Yenamandra
>
>
>
>
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