Dear MEMS talkers,

Please advice me what kind of wafer spec. I have to consider to make SOG
wafer.
I'm going to use andic bonding process to bond a  Si and glass.

What is the conventional spec. for following terms?
- Roughness of Si and glass
- Thickness of Si and glass
- Resistivity, doping type, and cryatalline plane of Si wafer
- Kind of glass

Thank you

Lee, Duhyun

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duhyun@skku.edu
Technology Innovation Center(TIC)
Dep. of Advanced Materials Eng.
Sungkyunkwan University, KOREA
Tel +82-31-290-5645
Fax +82-31-290-5644
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