Hi Seong-Hyok
For DRIE I us crystal bond 555 from Aremco Company.
http://www.aremco.com/a9.html
Heating the wafer, support or device wafer, to about 60 degC on a thin
Al foil on the hot plate. Dispense
some white wax on it and place the second wafer on top. Be careful to
not include
air bubbles. They can cause blow off parts of your wafer.
Take the sandwich away from the hot plate and press the wafers together
until
they stick. Make sure to remove all white wax from the edge (with wet
towel)
in order to not contaminate your chuck.
After the etch put the wafers again on the hot plate and separate them
carefully
or put the wafers into warm water for some minutes or hours, depending
on the
open aereas where water can attack the white wax.
Hope that helps you.
Greetings
Stefan

-----Original Message-----
From: mems-talk-bounces+blunier=imes.mavt.ethz.ch@memsnet.org
[mailto:mems-talk-bounces+blunier=imes.mavt.ethz.ch@memsnet.org] On
Behalf Of Seong-Hyok Kim
Sent: Montag, 9. Februar 2004 08:05
To: General MEMS discussion
Subject: [mems-talk] An epoxy for DRIE


Dear MEMS researchers,

I'm Seong-Hyok Kim working in Korea. I tried to fabricate a silicon
structure by using SOI bulk micromachining, but I'm suffering from some
problems during DRIE etch-through.

At first, I used thick PR to bond a main wafer to handle wafer
indirectly, and softbaked it. However, the results was not so good. The
uniformity was bad, and the wall profile was not so good. Unfortunately,
we could not seperate the bonded wafer easily.

I've heard that a kind of thermal conductive epoxy can be used for
bonding the wafers And the main wafer which is epoxy-bonded to the
handle wafer could be released by using DRIE process. Also, someone said
that the epoxy-bonded wafer could be easily detached from the other
wafer by using acetone only !

Could anyone help me find such kind of thermal conductive epoxy ? Or,
could anyone recommend bonding materials and bonding-methods to be used
for etch-through DRIE ?

Thank you very much in advance.

Seong-Hyok Kim



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