Hi, all

I am trying to get a undercut profile with AZ 5214 photoresist on Si/SiO2 wafer.
It is weird that I always get an overcut profile. Does anyone have any idea
about this problem?

Here is the recipe I tried:

Prebake 95 degree for 45 second
Image exposure for 2-5 second at 10mW/cm^2 (Karsuss MJB3 mask aligner)
Post bake 45-60 second at 115 degree
Flood expose 15-100second

Thanks,


University of Arizona



Quoting BobHendu@aol.com:

> HMDS is best done in a YES oven under controlled conditions. You might
> contact Bill Moffet at Yield Engineering Services for better instruction.
>
> It might be to no avail as the work we have done on our new silicon etch
> process shows a selectivity of oxide to silicon of around 1:100. If the math
> is right you will only be able to etch around 70 microns total before you run
> out of hard mask material. You might need to thicken up the oxide and etch it
> with plasma to insure proper wall angle before Silicon etch process. Bob
> Henderson
>
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