Hi,
  I am trying to etch the backside of a n-silicon
wafer. The back side of the wafer is not polished.
Please let me know if the backside needs to be
polished for a faster etch or it doesn't matter. I
learnt from a previous email of the group as how to
protect the front side during a long KOH etch of the
back side. The etchant I planning to use is 50% by
weight KOH solution at 70C. Also please let me know if
you have any suggestions for me during this process.
My target device is a thin diaphragm for a pressure
sensor. If you can please give me any web links that
go through the fab details of a pressure sensor.

Thank you very much.

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