For details of a pressure-sensor fabrication process, including etching the
diaphragm in KOH,
see the book "An Introduction to Microelectromechanical Systems Engineering"
by Nadim Maluf.
The second edition is due out in June.

----- Original Message -----
From: "harish pisipati" 
To: 
Sent: Monday, March 15, 2004 8:11 AM
Subject: [mems-talk] Back Etching of Si wafer with KOH


> Hi,
>   I am trying to etch the backside of a n-silicon
> wafer. The back side of the wafer is not polished.
> Please let me know if the backside needs to be
> polished for a faster etch or it doesn't matter. I
> learnt from a previous email of the group as how to
> protect the front side during a long KOH etch of the
> back side. The etchant I planning to use is 50% by
> weight KOH solution at 70C. Also please let me know if
> you have any suggestions for me during this process.
> My target device is a thin diaphragm for a pressure
> sensor. If you can please give me any web links that
> go through the fab details of a pressure sensor.
>
> Thank you very much.
>
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