Hi Marcus,
As a rule of thumb you want a surface roughness of <2nano meters. You will also
need to take note of wafer TTV and bow and warp.  A good book on bonding is
"Semiconductor Wafer Bonding:  Science and Technology" by Q.-T. Tong and U.
Gosele.
Feel free to contact me with any bonding questions,
Brad

Brad Johnson
Suss MicroTec
Applications Engineer
Phoenix 1-480-557-9370 Ext119
Vermont 1-800-685-7877 Ext305
bjohnson@suss.com


>>> Marcus.Torndahl@elmat.lth.se 03/15/04 09:12AM >>>
Hi,

I am searching for some information or guidelines when bonding silicon
nitride to silicon, silicon dioxide or silicon nitride. I found an article

"Spontaneous direct bonding of thick silicon nitride"
S Sanchez, C Gui and M Elwenspoek
J. Micromech. Microeng. 7 (1997) s111-113

which addresses the importance of surface smoothness with CMP before
bonding. Is there any other good references or guidelines I could use before
proceeding with my bonding experiments.

Regards,

Marcus Törndahl

Ps. Thank you for a most interesting and educating forum Ds.
_____________________________________________
Marcus Törndahl (PhD student, MScEE)
Department of Electrical Measurements/LTH
Lund University
Ole Römers väg 3
SE-221 00 Lund
Sweden