JW, Try slower ramping to your soak power (just to the melting point), then a slower ramp to your pre-dep power that should be set 1 or 2% lower than dep power. I have a dual shutter system that I open my lower shutter for 100A for the system to settle before the upper shutter opens. I need a very accurate film thickness. Be sure you have melted in your new Au slowly and completely before trying the above. I too have blown all my Au out of the pocket, but that was back in the 80's. Brent J W wrote: > Hi, > > I'm trying to deposit gold using Ebeam evaporation, > but kept having metal spitting problems. I tried to > change the equipment running conditions like longer > soak time, soak power close to deposition power, > altering beam sweeping pattern. Sometime it improves > and other time it doesn't. Are there any other > factors that needs to be considered to get rid of the > spitting? > > Thanks! > J.W. > > __________________________________ > Do you Yahoo!? > Yahoo! Mail - More reliable, more storage, less spam > http://mail.yahoo.com > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/