Hi Adnan, Thank you for your advice. I'll try it out. brgds, Nang Htoi adnan merhabawrote: hi The copper might be contaminated/oxidized from prior processing. Try dipping your wafer for 30 seconds in 10% Sulfuric Acid prior to etching. It will greatly increase your etching uniformity. regards, adnan merhaba --- Lahpai Nang Htoi wrote: > Hi, > > I have an issue with Cu UBM wet-etching. I use > Nitric acid together with acetic acid and hydrogen > peroxide. Although my over etching time is long > enough (50 to 80%) to clear all un-masked Cu, round > shape Cu residue is left behind. > Does anyone know what causes this kind of residue? > Any idea or suggestion will be greatly appreciated. > > Thanks & brgds, > Nang Htoi > > > --------------------------------- > Do you Yahoo!? > Win a $20,000 Career Makeover at Yahoo! HotJobs > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe > or change your list > options, visit > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS > processing services. > Visit us at http://www.memsnet.org/ __________________________________ Do you Yahoo!? Win a $20,000 Career Makeover at Yahoo! HotJobs http://hotjobs.sweepstakes.yahoo.com/careermakeover _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/ --------------------------------- Do you Yahoo!? Win a $20,000 Career Makeover at Yahoo! HotJobs