durusmail: mems-talk: 50 +/- 5 micron through hole in Pyrex wafer
refraction index of LPCVD silicon dioxide
2004-05-14
2004-05-14
2004-05-14
2004-05-17
2004-05-15
2004-05-17
50 +/- 5 micron through hole in Pyrex wafer
2004-05-17
2004-05-18
2004-05-18
50 +/- 5 micron through hole in Pyrex wafer
Zheng Xia
2004-05-18
Patrick,

You may try laser drilling from one of following companies:

www.potomac-laser.com
www.norsam.com
www.jpsalaser.com

-----------------------------------------------
XIA,ZHENG
Microfluidics and BioMEMS Lab
Interdisciplinary Microsystems Group
Department of Mechanical and Aerospace Engineering
University of Florida
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-----Original Message-----
From: mems-talk-bounces+zxia=grove.ufl.edu@memsnet.org
[mailto:mems-talk-bounces+zxia=grove.ufl.edu@memsnet.org] On Behalf Of
Patrick Roman
Sent: Monday, May 17, 2004 3:36 PM
To: General MEMS discussion
Subject: [mems-talk] 50 +/- 5 micron through hole in Pyrex wafer

MEMS-talk:


What is the recommended process method to produce a 50 +/- 5 micron through
hole in a 1mm thick Pyrex wafer?  Dimensional tolerances and repeatability
are important to our design.


--

Patrick Roman, M.S.
Microsystems Engineer
Code 553- Detector Systems Branch
Room E042 Building 11
NASA/ Goddard Space Flight Center
Greenbelt,MD 20771
phone: (301) 286-3558
fax: (301) 286-1672
mobile: (202) 294-8602
email: proman@pop500.gsfc.nasa.gov


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