Well, CO2 lasers are out, as is ultrasonic drilling.  I don't know about RIE
or other methods, but you might look into excimer lasers - one company that
specializes in excimer laser micromachining is:
http://www.potomac-laser.com/
(They have a technology that allows for a very small spot size.)



David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
-----Original Message-----
From: mems-talk-bounces+nemeth=sophiawireless.com@memsnet.org
[mailto:mems-talk-bounces+nemeth=sophiawireless.com@memsnet.org]On
Behalf Of Patrick Roman
Sent: Monday, May 17, 2004 3:36 PM
To: General MEMS discussion
Subject: [mems-talk] 50 +/- 5 micron through hole in Pyrex wafer


MEMS-talk:


What is the recommended process method to produce a 50 +/- 5 micron through
hole in a 1mm thick Pyrex wafer?  Dimensional tolerances and repeatability
are important to our design.


--

Patrick Roman, M.S.
Microsystems Engineer
Code 553- Detector Systems Branch
Room E042 Building 11
NASA/ Goddard Space Flight Center
Greenbelt,MD 20771
phone: (301) 286-3558
fax: (301) 286-1672
mobile: (202) 294-8602
email: proman@pop500.gsfc.nasa.gov


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