Hi to all,             Can anybody suggest me on this problem...i deposited
first Ni(40nm) and then Au(80nm) on both Si and p-GaN under high vacuum after
patterning for the Lift-off process...but at the time of Lift-off the whole
deposited metal got stripped off...actually after deposition at room temperature
i just heated the sample in-situ (in vacuum) at 100C for one hour...Is this the
problem of sticking of Ni with Si and p-GaN or some other problem...Suggest
me... Thank You Hare KrishnaM.Tech Student IIT Kanpur





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