Dear colleagues,

anyone knows how to prepare following sample?

material: soft-baked SU-8 resist (>1mm) on top of an Si wafer (500 um)
sample form: stripes 20 - 50 um thick, cutting plane perpendicular to the
wafer (total size of a sample = (Si thickness + resist thickness) x 20 - 50
um)
special requirements: minimal heat production during the sample preparation

classical saw technique will probably not work because of the heat

Does anyone have any suggestions or does anyone know somebody who could
help?

Thanks a lot

Best regards

Josef Kouba
BESSY GmbH, AZM Group
Albert-Einstein-Strasse 15
12489 Berlin
Tel.: +49 30 6392 3125
Fax.: +49 30 6392 4682
josef.kouba@bessy.de
www.azm.bessy.de