Josef, If classical sawing creates a problem you can use a dual beam FIB to create the cross-section. If you don't have access to such a tool you could try scribing the back side and the cleaving it. Jon Hiller Jon M. Hiller Argonne National Laboratory Electron Microscopy Center Materials Science Division Tel: 630-252-9558 Fax: 630-252-4289 -----Original Message----- From: mems-talk-bounces+hiller=anl.gov@memsnet.org [mailto:mems-talk-bounces+hiller=anl.gov@memsnet.org] On Behalf Of Josef Kouba Sent: Wednesday, June 09, 2004 8:08 AM To: MEMS Submission Subject: [mems-talk] How to make an SEM sample? Dear colleagues, anyone knows how to prepare following sample? material: soft-baked SU-8 resist (>1mm) on top of an Si wafer (500 um) sample form: stripes 20 - 50 um thick, cutting plane perpendicular to the wafer (total size of a sample = (Si thickness + resist thickness) x 20 - 50 um) special requirements: minimal heat production during the sample preparation classical saw technique will probably not work because of the heat Does anyone have any suggestions or does anyone know somebody who could help? Thanks a lot Best regards Josef Kouba BESSY GmbH, AZM Group Albert-Einstein-Strasse 15 12489 Berlin Tel.: +49 30 6392 3125 Fax.: +49 30 6392 4682 josef.kouba@bessy.de www.azm.bessy.de _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/