Hi Marie,

thanks a lot for your advice, but it would not work in my case I guess.. the
sample is only supposed to be about 20 um thick and the resist hight is over
1 mm. even if I would manage to cut the wafer with 20 um precision, cleaving
it after with 1 mm resist on top of it would be impossible.

Any other suggestions? there must be a way how to do it, there are so many
samples which have to be investigated such a way and they are often even
more tough and larger that mine..

J-

----- Original Message -----
From: "Tripp, Marie Kathleen" 
To: "General MEMS discussion" 
Sent: Thursday, June 10, 2004 9:13 AM
Subject: RE: [mems-talk] How to make an SEM sample?


> Hi Josef,
>
> I like to use a saw to pre-scribe wafers which I want to break later on.
I use a normal dicing saw but only cut partially through the wafer on the
backside.  Then do my normal spinning, etc. for photo-litho.  When I want to
break the wafer later on the fracture lines are already defined.  I like
this technique because all of the mess and heat of dicing is done with
before any of the photo-litho.
>
> Cheers,  Marie
>
>
>
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