Hello,

We are ion milling a thin layer of Au/Cu on a polymeric substrate, while
using photoresist (AZ5124EIR) as the etch mask.  The ion milling works very
well for etching the Au and Cu.  However, the process results in
crosslinking of the photoresist where we cannot remove it from the
remaining Au/Cu traces on the substrate, even through heated NMP based
stripper baths for 20 hours.  Unfortunately, ashing would damage the
polymeric substrate.  Does anyone have a suggestion on how to remove the
remaining photoresist?

Sincerely,

Robert Dean
Auburn University