Hi all,

         I am trying to sputter thick Cu ( 1 um) in a DC sputtering system.my
sputtering conditions are as follows :-

base pr- 10 exp(-6) torr

chamber pr -10 m torr

Ar gas flow - 10 sccm.

power - 250 W

Target to substrate distance - 5 cm.

my problem is that the resistivity of my deposited Cu is very high (24 micro ohm
cm) which is about 15 times the bulk resistivity of Cu( 1.6 micro ohm cm).

does anybody any any experience with deposition of thick Cu with low resistivity
values.pls let me know.
       Thanks in advance,
                  Dipankar

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