>Could you pls let me know what kind of heat treatment you do for Cu.

I am reluctant to do so, because with your level of contaminants,
anneal will not help! Typical conditions are 200-250C for 30-45min
furnace, or 30-45s 250-450C RTP, both in Nitrogen.

>Also i am using Cu along with Cr as an adhesion layer.Whatever i do Cr always
get oxidized.

As pointed out already, and not only by me, your base vacuum is at least
2 orders of magnitude above what you need to do the process you want.

best regards,
klaus

--
Klaus Beschorner
Metron Technology Europe, PVD (Eclipse) Process Manager
Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683