Hello:
I have a silicon wafer (around 800um thick) with 300nm SiO2 on one side. and i
want to etch some small squares (2cm*1.5cm) through silicon without breaking
the Sio2 layer above those squares. Is it possible? I am worrying about the
thickness of the SiO2 layer and its intrinsic stress. Will increasing the
thickness to 500nm be helpful? thanks.

Regards,
Yilei Zhang