I hope this would help you. SU-8 is composed of three components; an EPON epoxy resin, an organic solvent, and a photoinitiator [1]. The chemical formula of EPON resin SU-8 is a multifunctional glycidyl ether derivative of bisphenol-A novolac used to provide high-resolution patterning for semiconductor devices. The second one is gamma-butyrolactone (GBL), an organic solvent. The quantity of the solvent determines the viscosity of the solvent, which determines final thickness of the spin-coated film. Along with GBL, cyclopentanone is also used as a solvent for later products of SU-8 (SU-8 2000 series). And the third one is triarylium-sulfonium salts (CYRACURE® UVI from Union Carbide), a photoinitiator which is approximately 10 wt % of EPON SU-8. Epoxy resins could be cationically polymerized by utilizing a photoinitiator which generates strong acid upon exposure to ultraviolet light (365 to 436 nm) and the acid facilitates polymeric cross-linking during post-exposure bake. [1] J. M. Shaw, J. D. Galore, N. C. La Bionic, W. E. Coney, S. J. Holmes, "Negative photoresists for optical lithography," IBM Journal of Research & Development, vol. 41 No. ½-Optical lithography, 1997. Best regards. Daniel Sang-Won Park Graduate Research Assistant UTD MiNDS (http://www.utdallas.edu/~jblee/research/index.html) Lab [Cell] 214-952-8649, [Fax] 972-883-6839 [E-mail] spark@utdallas.edu [Web] http://www.utdallas.edu/~spark ----- Original Message ----- From: "Jung-Sik KIM"To: Sent: Wednesday, June 23, 2004 2:13 PM Subject: [mems-talk] SU-8 chemical composition > Dear MEMS COMMUNITY, > > This is Jungsik Kim in the University of Birmingham. > > I have been used GTA(Thermogravimetric analysis) for SU-8 under Nitrogen > atmosphere and ambient air conditions. > Under N-gas, nearly 20% mass of SU-8(mostly Carbon) remained, but under > air with Oxygen, almost all of them were burned out. > > Therefore, I'm searching for help. > Has anyone knows chemical composition of SU-8? > > If yes, please let me know that. > > Best wishes, > > Jungsik Kim > > ========================================= > Mr. Jung-Sik, Kim > School of Manufacturing and Mechanical Engineering > The University of Birmingham > Edgbaston, Birmingham B15 2TT > Tel: 44 (0)121 414 4245 > Fax: 44 (0)121 414 3958 > ========================================= > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/