Dear Memers:
        I am use O2 RIE plasma for my polyimide etching.
I use 200nm Nickle layer(RF sputtered) as mask layers.
and the Polyimide is about 10um thickness, and it spun on a 200nm Nickle
layers. But when I increase the etching times, there is still some gray
remainder on the bottom Nickle. The RIE plasma I have used is 100W,80SCCM
O2 gas.How can I remove the remained layers on the bottom. Some one can
give me some advice.
                                                 yours
                                                  wang hai
                                                  2004.6.16