Never thought to run that high of a temperature but it seems to make for great
rates. Does it also produce cleaner surfaces at completion? Bob

In a message dated 6/29/2004 12:17:26 PM Eastern Daylight Time, "Bill Moffat"
 writes:

>Bob,
>    Good to see you are still active on the web.  You are right about the
addition of CF4 one of our customers is using 30% CF4, 70% O2, running hot near
270 degrees C and removing 8 microns of hard baked Polymide in 4 minutes.  Bill
Moffat
>
>-----Original Message-----
>From: BobHendu@aol.com [mailto:BobHendu@aol.com]
>Sent: Tuesday, June 29, 2004 7:59 AM
>To: General MEMS discussion
>Subject: Re: [mems-talk] polyimide etching
>
>
>Try adding some CF4 to you oxygen. This will help to remove some of the filler
material which is contained in Polyimides. It doesn't always give a clean etch
but it works for most imides. Bob Henderson
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