I had a lot of success using an RIE with 80% CF4 and 20% O2.  I would
pattern SU-8, plate, then remove the SU-8.  RIE is anisotropic though.
I've heard of people using similar formulas in barrel ashers to do it
more isotropically.

Greg

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Tingrui Pan
Sent: Sunday, July 04, 2004 2:24 PM
To: General MEMS discussion
Subject: [mems-talk] SU-8 Removal

Dear Colleagues,

Does anyone have any experience on removing SU-8 layer after
photolithography (with or without hard bake)? I need to use SU-8 as a
mold
to do electroplating and SU-8 should be removed eventually. Thank you
very
much for any of your suggestion,

-----------------------------------------------
Tingrui Pan
Ph.D. Candidate
Electrical Engineering
University of Minnesota
Phone:   612-626-7188 (Lab)
         612-624-5034 (Office)
Website: www.ece.umn.edu/groups/umbmlab
-----------------------------------------------


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