>From my experience, most case bonding or attaching chips to carrier
wafer is more critical than the material you choose.

We use photoresist for a lot of our work, and it works perfect.

Xu Zhu

-----Original Message-----
From: BobHendu@aol.com [mailto:BobHendu@aol.com]
Sent: Thursday, July 08, 2004 5:49 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Question about thermal conductive glue for drie

We sometimes use Fomblin oil and it seems to help with heat spread. In a
message dated 7/8/2004 2:40:03 PM Eastern Daylight Time, "Han Geun Yu"
 writes:

>Hi, I am struggling with heat problem of substrate while doing drie.
Because I use small piece, I need carrier wafer to do drie and I think
it makes heat to flow little. If you know any glue or greese to increase
the heat flow, please let me know.
>
>Thank you.
>
>Han
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