Dear colleges, I use 80um thick device layer SOI wafer to fabricate a MEMS structure with DRIE. The box layer is 1.2um thick.The trenches in the structure is 80um deep and 5um wide.When I release the structure with HF solution, I find it can't be released after many hours!what is the problem? The depth/width ratio is too high? Thanks for your possible help! Weidong Shen Zhejiang University,Hangzhou,P.R.China _________________________________________________________________ 免费下载 MSN Explorer: http://explorer.msn.com/lccn