Hi Guys,

I want a SOI wafer with device (top) silicon layer 0.5 micron, but
the thinnest device silicon layer of the SOI wafers I can get is 3 microns.
A method to thin the device silicon layer from 3 microns to 0.5
micron is to use thermal oxidation or CMP. Does anyone how these
methods and give me some advice?

Thank you in advance.

Zheyao Wang