Hi,

I am trying to set up a process for releasing my MEMS structures so that
I avoid stiction in the drying phase.
I've read about substituting DI water with Cyclohexane - cooling to -10
degrees C and then bring the device back up to room temperature (25C) as
a method of doing this. I have found a couple of papers on the subject -
but none give a very detailed description of the process and equipment
used.
Does anyone have any experience of this method of drying and if so can
you give me any pointers.
Thanks in advance for your help.

Anthony Cooper
PhD Researcher
Microsystems Group
School of Mechanical Engineering
The University of Birmingham
Edgbaston
Birmingham
B15 2TT
England

Tel: 07919037533