Daven,

One method is to deposit an intermediate layer on both substrates, and apply
heat and force. For example, spin coat a negative resist or similar material,
heat to ~100C (depending on material), and apply moderate force. The best
bonding method and materials will depend on the requirments and restrictions of
the device and process

Best Regards,

Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
C.Brubaker@EVGroup.com, www.EVGroup.com

This message and any attachments contain confidential or privileged information,
which is intended for the named addressee(s) only. If you have received it in
error, please notify the sender immediately and then delete this e-mail. Please
note that unauthorized review, copying, disclosing, distributing or otherwise
making use of the information is strictly prohibited.

 -----Original Message-----
From:   mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]  On
Behalf Of daven chou
Sent:   Monday, August 23, 2004 5:55 AM
To:     mems-talk@memsnet.org
Subject:        [mems-talk] how to bond silicon wafer to stainless steel?

Dear everyone,
Are there anyone can suggest a recipe to bond the silicon wafer to
stainless steel? Thank you in advance!

--
sincerely,
Daven Chou
_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/