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Hi All,
        I have a rectangular structure of about 200 microns * 1200 microns.
This structure has to be released using a 2000 A sacrificial oxide layer
underneath it. I was wondering if someone could point me to resources
that would give me a good idea as to how big and how many etch holes I
need in the structure to release it using either HF or CO2 critical
drying. Any input would be appreciated.
Thanks,
Kishore

______________________________________________________________________________
Kishore Sundara-Rajan                   Dept. of Electrical Engineering
Graduate Research Assistant             University of Washington
kishore@u.washington.edu                Campus Stop 352500
Mobile : (206) 351-8101                 Seattle WA 98105
Fax    : (206) 632-3080                 Office : (206) 221-6673
http://students.washington.edu/kishore  www.kishore-sr.com
PGP Finger Print: BE5A 90BE 904F 766B 979A 910E E831 C2C3 0347 235F
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iD8DBQFBK4f36DHCwwNHI18RAqg/AJ9qyY1h5FCr6l8NqBLfZcuhtPyWLwCffFvs
GkBl7gAQDvP4WAcm0fBYtG4=
=iN4p
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