Hi Kishore, The conditions would depend on your own criteria. How thick is your device layer, concentration and temperature of HF being used, stresses in the structure, what is the purpose of the structure being released, amount of time to consider incompatibilities, etc. If you are just looking for general information, I would recommend 2-5 um holes for a 50 um thick layer because the etching will be limited by the thickness of the oxide layer and not to the size of your hole. Have a symmetric arrangement of holes if you want the structure to release uniformly. Conduct an etch profile and hole redesign to compensate for structural stress which can produce unwanted silicon "divots". Also use a microscope equipped with an IR camera to determine the actual etch rates for your particular device and oxide quality. Good luck. Phillipe Tabada divots = created from high stressed structures during release as to rip out silicon particles either from the device and/or substrate layer. >From: Kishore Sundara-Rajan>Reply-To: kishore@u.washington.edu,General MEMS discussion > >To: mems-talk@memsnet.org >Subject: [mems-talk] Oxide Release - Etch Holes >Date: Tue, 24 Aug 2004 11:24:55 -0700 > >-----BEGIN PGP SIGNED MESSAGE----- >Hash: SHA1 > >Hi All, > I have a rectangular structure of about 200 microns * 1200 microns. >This structure has to be released using a 2000 A sacrificial oxide layer >underneath it. I was wondering if someone could point me to resources >that would give me a good idea as to how big and how many etch holes I >need in the structure to release it using either HF or CO2 critical >drying. Any input would be appreciated. >Thanks, >Kishore > >______________________________________________________________________________ >Kishore Sundara-Rajan Dept. of Electrical Engineering >Graduate Research Assistant University of Washington >kishore@u.washington.edu Campus Stop 352500 >Mobile : (206) 351-8101 Seattle WA 98105 >Fax : (206) 632-3080 Office : (206) 221-6673 >http://students.washington.edu/kishore www.kishore-sr.com >PGP Finger Print: BE5A 90BE 904F 766B 979A 910E E831 C2C3 0347 235F >- -----BEGIN GEEK CODE BLOCK----- >Version: 3.1 >GE d- s+:+ a->? C++++ U++ P L++ E W+++ N o K- w--- O M+ V-- PS+ PE- Y+ >PGP+++ t++ 5-- X++++ R tv+ b++++ DI+++++ D++++ G++ e++++ h++ r* y? >- ------END GEEK CODE BLOCK------ >______________________________________________________________________________ >-----BEGIN PGP SIGNATURE----- >Version: GnuPG v1.2.1 (MingW32) >Comment: Using GnuPG with Mozilla - http://enigmail.mozdev.org > >iD8DBQFBK4f36DHCwwNHI18RAqg/AJ9qyY1h5FCr6l8NqBLfZcuhtPyWLwCffFvs >GkBl7gAQDvP4WAcm0fBYtG4= >=iN4p >-----END PGP SIGNATURE----- >_______________________________________________ >MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list >options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk >Hosted by the MEMS Exchange, providers of MEMS processing services. >Visit us at http://www.memsnet.org/ _________________________________________________________________ FREE pop-up blocking with the new MSN Toolbar get it now! http://toolbar.msn.click-url.com/go/onm00200415ave/direct/01/