Hello all,
I have deposited ~ 2-3um of SiO2 on a polyimide (PI2610). Subsequent
process steps require curing @ ~ 265 C. I notice big cracks in the Oxide
and also large chunks of it just peel off.
Before resorting to sputtering, I have also tried spin-on-glass but faced
similar problems.
Any suggestions on the cause and/or remedy would be greatly appreciated.
Thanks.

Aamer Mahmood
Grad Res Assist
Microsensors lab
UT Arlington