Dear all,

I cut a fresh wafer into pieces using a diamond wafer saw and distilled
water. However I did not cover the surface to protect it from dirt.

What is the best way to remove the residues from the Si surface without
roughening it? For the application of biological layers I need really
smooth surfaces.

Right now I am trying DI water in an ultrasonic bath, but this seems not
efficient enough...

Any helpful tips are greatly appreciated!

Thank you, Karin

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Walter Schottky Institut
Technische Universitaet Muenchen