Karin, If you have let the silicon residue dry, there is not much that will remove it without causing damage to the surface. If your surfaces are passivated and you have kept the surface wet from the time it was diced, then you could use a 'paint pad' with a 'soap' solution to clean the surface before you put it in the ultrasonic for final cleaning. We used to use these pads just after a water flush while still on the saw ( prior to the newer fancy saw and clean units) for all of our semiconductor wafers with good results. You may also consider using a 'soap' solution DURING your sawing operation if your saw is set up to facilitate this. This would help to keep the particles in suspension longer while you flush them with water and then clean after sawing. Regards Ken Karin Buchholz wrote: > Dear all, > > I cut a fresh wafer into pieces using a diamond wafer saw and distilled > water. However I did not cover the surface to protect it from dirt. > > What is the best way to remove the residues from the Si surface without > roughening it? For the application of biological layers I need really > smooth surfaces. > > Right now I am trying DI water in an ultrasonic bath, but this seems not > efficient enough... > > Any helpful tips are greatly appreciated! > > Thank you, Karin > > -- Walter Schottky Institut > Technische Universitaet Muenchen > > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ > -- Kmbh Associates 47 Rocket Circle Rancho Cordova, CA 95742 U S A 510-714-5055 Efax- 510 217 4421 or 561 658 6136 High Purity Float Zone and Specialty CZ Silicon for Power, IR and Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor applications. Service in SOI, Polishing SSP and DSP. Quartz, Glass, Pyrex and Borofloat Wafer Supply. Anodic Bonding. SOG, SOS.