durusmail: mems-talk: Removing sawing residues from Si surface
Removing sawing residues from Si surface
2004-09-02
2004-09-02
2004-09-03
2004-09-02
Removing sawing residues from Si surface
Kasman , Elina
2004-09-02
Is this plain Si wafer? Take it through the standard cleaning process
(piranha, HF), this should take care of those residues. You may want to
first try acetone and IPA rinse...
Sounds like the residue is due to water stains.


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Karin Buchholz
Sent: Thursday, September 02, 2004 9:47 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Removing sawing residues from Si surface


Dear all,

I cut a fresh wafer into pieces using a diamond wafer saw and distilled
water. However I did not cover the surface to protect it from dirt.

What is the best way to remove the residues from the Si surface without
roughening it? For the application of biological layers I need really
smooth surfaces.

Right now I am trying DI water in an ultrasonic bath, but this seems not

efficient enough...

Any helpful tips are greatly appreciated!

Thank you, Karin

--
Walter Schottky Institut
Technische Universitaet Muenchen


_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/

reply