Dear Karin,

Deposit a thin layer (1.5 micron does the job) of photoresist before you
dice up your samples. In case of negative resist, do a flood exposure in
UV first and an after exposure bake before you start dicing. During the
dicing, the Si wafer will be shielded from debris. When you're done
dicing, you simply remove the protective resist layer with a resist
developer, and thoroughly rinse it with DI water. This trick helps me to
get very clean samples, even after a rough dicing job.

Hope this helps,
Ronald Dekker.

University of Twente,
MESA+ Research Institute, Integrated Optical Micro Systems,
P.O. Box 217,
7500 AE Enschede,
The Netherlands.
Tel.: xx-31-53-4894440
Fax: xx-31-53-4893343
E-mail: R.Dekker@utwente.nl
http://www.mesaplus.utwente.nl/

-----Original Message-----
From: Karin Buchholz [mailto:buchholz@wsi.tum.de]
Sent: Thursday, September 02, 2004 4:47 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] Removing sawing residues from Si surface

Dear all,

I cut a fresh wafer into pieces using a diamond wafer saw and distilled
water. However I did not cover the surface to protect it from dirt.

What is the best way to remove the residues from the Si surface without
roughening it? For the application of biological layers I need really
smooth surfaces.

Right now I am trying DI water in an ultrasonic bath, but this seems not

efficient enough...

Any helpful tips are greatly appreciated!

Thank you, Karin

--
Walter Schottky Institut
Technische Universitaet Muenchen


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