Hi Karin
              Did you let the wafer surface dry after cutting ?
This is a definite MUST NOT DO.
Once surface is dry the thin oxide layer forming on the particles sticks
them firmly to the wafer surface.
Keep the wafers wet then transfer them to a very dilute surfactant (Soap
solution) this with ultrasonics should do the trick.
Then wash again in DI.

Alternatively talk to EVG EVGroup.com who make a megasonic wafer cleaner
to do the trick.

Best regards

Jan Newman  (EVG, UK and Ireland)





>Dear all,
>
>I cut a fresh wafer into pieces using a diamond wafer saw and distilled
>water. However I did not cover the surface to protect it from dirt.
>
>What is the best way to remove the residues from the Si surface without
>roughening it? For the application of biological layers I need really
>smooth surfaces.
>
>Right now I am trying DI water in an ultrasonic bath, but this seems
>not efficient enough...
>
>Any helpful tips are greatly appreciated!
>
>Thank you, Karin
>
>--  Walter Schottky Institut
>Technische Universitaet Muenchen
>
>
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--
newman