At 01:17 PM 11/10/98 -0800, you wrote:
>Dear Colleagues,
>
>We are seeking a source for a small quantity of SOI wafers with a Si
>thickness of about 50 microns for deep silicon RIE. We would prefer 4"
>diameter wafers, but other sizes may be acceptable. Substrate/overall
>thickness should be as large as possible.
>
>As an alternative to these, we are considering bonding a 50-micron Si wafer
>to glass. Does anyone know good sources for thin wafers and flat glass
>substrates, and someone who can do the bonding?
>
>If anyone has any leads, we'd much appreciate it.
>
>Thanks very much,
>
>Adam Cohen
>University of S. California
>
>
>


Adam, AMMi can supply you
with both the SOI wafers you need and the DRIE
etching in house.

Let me know if we can be of further assistance.




Christopher Bang
Manager, Sensors and Actuators
Advanced MicroMachines Inc.
11000 Cedar Avenue
Cleveland, OH 44106

tel: 216-229-4636 x207
fax: 216-229-4774
bang@memslink.com
http://www.memslink.com